Global top enables packaging after PCB patch and wire bonding, making design changes more flexible. The sealant of globe top is a material for protecting chips and bonding leads, which is commonly used in cob packaging process on circuit board. For example, the chip, gold wire protection, and protection pasted products are top sealed to protect the barrier and isolate the physical and chemical damage caused by humidity, cold and heat shock, corrosion, bending, vibration and fatigue.